Nvidia Part III: The Dawn of the AI Era (2022-2023)

9976.634 - 10000.725 Ben Gilbert

Yep. And even if you got the customer demand, you'd need to contract with TSMC to get the manufacturing capability of their newest cutting-edge fabs to do this 2.5D co-auth lithography and packaging, which there, of course, isn't any more of. So, you know, good luck getting that. And even if you figured out how to do that, you'd need to build software that is as good or better than CUDA.