Acquired
Nvidia Part III: The Dawn of the AI Era (2022-2023)
Ben Gilbert
It's a more sophisticated way of doing real copper to real copper direct connection Without a silicon interposer, I'm getting into a little bit of the details, but basically it's more sophisticated than the process that the H100 2.5D is using to make sure that memory is extremely close to compute. And does that matter? Not really.
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