Acquired
Nvidia Part III: The Dawn of the AI Era (2022-2023)
Ben Gilbert
Anyway, the 2.5D chip packaging technology from TSMC is where you take multiple active silicon dies, like the logic chips and the stack of high bandwidth memory, and they stack them on one piece of silicon. And there's more complexity here, but the important thing is CoaS is the most popular technology for GPUs and AI accelerators for packaging these chips.
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